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• Highest commercially available pulse energy and
peak power
• Tighter process control due to superior energy stabil
ity enabled by unique intracavity harmonic generatio
• Capable of processing widest range of materials due
to wide range of pulse energies and repetition rates
• High reliability due to low fluence in harmonic
crystals and no cavity optic coatings exposed to UV
• 355 or 532 nm outputs available |
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• Solar cell processing
• Wafer scribing
• Full-cut thin wafer dicing
• Low-k dielectric grooving
• Micro via drilling
• Micromachining of silicon and metals |
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